Features
- 0.4mm pitch
- Compression surface mount
- High performance/low cost achieved through use of carrier loaded stamped contact
- Z-axis compliant buckle beam contact supports any type of solder ball
Brand |
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Body Materials | PES, PEI, LCP or Equivalent |
Contact Material | Beryllium Copper Alloy |
Contact Plating | Gold |
Contact Force | 13 gram average |
Contact Resistance | 200-300 mΩ |
Temperature Rating | 150°C |
Durability | 10,000 cycles min. |