Features
- 0.5mm and 0.8mm pitch
- Compression surface mount
- High performance/low cost achieved through use of carrier loaded stamped contact
- Z-axis compliant buckling beam contact provides stable contact performance independent of solder ball height and compression
- Advanced latch mechanism with flexible pressure pads provides uniformed force distribution across the package surface, enabling the socket to handle up to 900 balls (full 30×30 matrix) and super thin packages.