Features
- 0.4mm, 0.5mm, 0.65mm, and 8mm pitch
- Low cost design using stamped cantilever contact
- Staggered, through hole tail design for BIB design consideration
- ACTIVE ALIGNMENT: Active IC guide feature improving on package alignment accuracy
- Optimal thermal contact for package e-pad
- Solutions for Power Devices (Consult your Sales Rep)
- Multiple ePad Pin
- Thermal Buttons/Slugs